Showing 1 - 20 results of 35 for search '莊東漢', query time: 0.58s Refine Results
  1. 1
    不銹鋼在氯化鈉溶液中的伽凡尼腐蝕
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  2. 2
    Interfacial reactions of Ag alloy wires with wire bonded pads for IC and LED packages
    by Che-Cheng Chang, 張哲誠
    Published 2013
    Other Authors: “...莊東漢...”
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  3. 3
    The Feasibility of Metallic Glass as Diffusion Barrier of Zn4Sb3 Thermoelectric Module
    by Chi-Shen Lai, 賴其伸
    Published 2018
    Other Authors: “...莊東漢...”
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  4. 4
    Effects of La Addition on Interfacial Reactions and Tin Whisker Growth of Sn-58Bi Solder BGA Packages
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  5. 5
    Sn20In2.8Ag球格陣列構裝界面反應研究
    by 吳峰誌
    Published 2002
    Other Authors: “...莊東漢...”
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  6. 6
    Sn0.9Cu球格陣列構裝界面反應研究
    by 王逸敏
    Published 2002
    Other Authors: “...莊東漢...”
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  7. 7
    Sn8Zn3Bi無鉛銲錫塑膠及陶瓷球格陣列界面反應研究
    by Chiu, Ming-Yen, 邱銘彥
    Published 2002
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  8. 8
    Sn-3.5Ag/Ag厚膜銲錫球格陣列構裝界面反應研究
    by Tsung-Lin Su, 蘇宗麟
    Published 2002
    Other Authors: “...莊東漢...”
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  9. 9
    錫銦銀無鉛銲錫與銅及鎳基材之界面反應研究
    by Kuei-Wei Huang, 黃貴偉
    Published 2001
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  10. 10
    錫鋅鉍無鉛銲錫與銅基材之界面反應研究
    by Wei Hong Lin, 林威宏
    Published 2001
    Other Authors: “...莊東漢...”
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  11. 11
    英高鎳718超合金之接合技術與超塑性成形複合加工研究
    by 葉明勳
    Published 1996
    Other Authors: “...莊東漢...”
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  12. 12
    The Effect of Neodymium and Lutetium Additions On the Properties of In-49Sn Solder
    by Chieh-Wei Hsu, 許倢瑋
    Published 2010
    Other Authors: “...莊東漢...”
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  13. 13
    The Effect of Lanthanum and Cerium additions on the properties of In-49Sn Solder
    by Boon-Ho Lee, 李文和
    Published 2010
    Other Authors: “...莊東漢...”
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  14. 14
    Microstructure and Interfacial Reactions of Bi-25In-18Sn Thermal Interface Materials
    by Cheng-Ting Chen, 陳正庭
    Published 2008
    Other Authors: “...莊東漢...”
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  15. 15
    Application of low temperature solid-liquid interdiffusion bonding for 3D-IC and LED packaging
    by Hong-Yuan Chen, 陳鴻元
    Published 2013
    Other Authors: “...莊東漢...”
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  16. 16
    The Effect of Cerium Additions on the Properties of Sn58Bi BGA Solder Joints
    by Hsing-Fei Wu, 吳醒非
    Published 2011
    Other Authors: “...莊東漢...”
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  17. 17
    Thin Film Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectrical Material with Cu/Ag Electrode
    by Che-Wei Lin, 林哲緯
    Published 2011
    Other Authors: “...莊東漢...”
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  18. 18
    The Study on Low-Ag Content Sn-Ag-Cu BGA Solder Joints with various Pb-free Surface Finishes
    by Chin-Liang Chen, 陳衿良
    Published 2010
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  19. 19
    Characterization of Mechanical Properties of Thin Film and Intermetallic Compound for Lead-Free Flip Chip Packages
    by I-Ting Tsai, 蔡怡庭
    Published 2005
    Other Authors: “...莊東漢...”
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  20. 20
    Studies on the Interfacial Reactions, Electromigration and Whisker Growth in rare-earth doped solder joints
    by Hsiu-Jen Lin, 林修任
    Published 2007
    Other Authors: “...莊東漢...”
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