Showing 1 - 20 results of 21 for search 'Ming Shiann Feng', query time: 0.07s Refine Results
  1. 1
    Technology of Electroplating Copper in Sub-0.15 um Trenches or Vias
    by Shih-Chieh Chang, 張世杰
    Published 2000
    Other Authors: “...Ming-Shiann Feng...”
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  2. 2
    Abrasive - Free Polishing for ULSI Cu Damascene Interconnects
    by Jeng-Yu Fang, 方政煜
    Published 2005
    Other Authors: “...Ming-Shiann Feng...”
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  3. 3
    Diffusion Behaviors of Si and Ge in GaN and Application of Ohmic Contacts
    by Bu, Chie Jin, 卜起經
    Published 1997
    Other Authors: “...Ming Shiann Feng...”
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  4. 4
    Characterization and Uniformity Control of Resist Thinning Using Plasma Ashing Technology
    by Kuo, Chun Yi, 郭俊伊
    Published 1997
    Other Authors: “...Ming Shiann Feng...”
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  5. 5
    Investigation of Cu Electroplating and Electropolishing Processing for Multilevel Interconnection
    by Shih-Chieh Chang, 張世杰
    Published 2003
    Other Authors: “...Ming-Shiann Feng...”
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  6. 6
    Study Self-Assembled Monolayer on Silicon-Pattern Fabrication and Chemical Sensor Application
    by lin fu-long, 林福龍
    Published 2003
    Other Authors: “...Ming-Shiann Feng...”
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  7. 7
    Application of Metal Catalyst on Liquid Crystal Display and Field Emission Display­ Effects of Metal Catalyst on the Growth of Low Temperature Poly-Si and Carbon Nanotubes
    by Chi Wei Chao, 趙志偉
    Published 2003
    Other Authors: “...Ming-Shiann Feng...”
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  8. 8
    Study on Selective Contact Displacement of Electroless Process for IC Manufacturing
    by 89nctu0159018, 李音頻
    Published 2001
    Other Authors: “...Ming-Shiann Feng...”
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  9. 9
    Abrasive Free Polishing for ULSI Cu Damascene Interconnect
    by Jeng - Yu Fang, 方政煜
    Published 2001
    Other Authors: “...Ming — Shiann Feng...”
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  10. 10
    Cooper Gate Electrode Fabrication and SiOx Gate Dielectric Properties on a-Si:H TFTs Electrical Characterization
    by Ho, Chia-chi, 何家齊
    Published 1996
    Other Authors: “...Ming-shiann Feng...”
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  11. 11
    Chemical Mechanical Polishing of PECVD Dielectrics: Characterization and Process Integration
    by Lin, Chi-Fa, 林啟發
    Published 1996
    Other Authors: “...Ming-Shiann Feng...”
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  12. 12
    Fabrication and Characterization of Amorphous and Microcrystalline Silicon Thin Film Transistor
    by Liang,Chia Wen, 梁佳文
    Published 1995
    Other Authors: “...Ming-Shiann Feng...”
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  13. 13
    Impacts of CVD Dielectric Characteristics on ULSI CMP Process and Memory Devices Performance
    by Chi-fa Lin, 林啟發
    Published 1999
    Other Authors: “...Ming-Shiann Feng...”
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  14. 14
    The study on Integration of Low Dielectric Constant Material Hydrogen Silsesquiox(HSQ) and Copper
    by Yi-Fang Cheng, 鄭懿芳
    Published 1999
    Other Authors: “...Ming-Shiann Feng...”
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  15. 15
    Study on Chemical-Mechanical Polishing of Low-Dielectric Constant Polyimide Thin Films
    by Ya-Li Tai, 戴雅麗
    Published 1999
    Other Authors: “...Ming-Shiann Feng...”
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  16. 16
    Investigation of Copper Electropolishing for Damascene Interconnects in ULSI
    by Huang Chih-Chang, 黃志昌
    Published 2002
    Other Authors: “...Ming-Shiann Feng...”
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  17. 17
    Study of Low-Dielectric-Constant Materials on Process Integration of beyond sub-micro MOS Integrated Circuits
    by Yi-Lung Cheng, 鄭義榮
    Published 2004
    Other Authors: “...Ming-Shiann Feng...”
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  18. 18
    Characterization of anodized Al2O3 and its application to a-Si: H TFTs with Al2O3/SiNx double-layered gate dielectric
    by Tseng-Chin Luo, 羅增錦
    Published 1994
    Other Authors: “...Dr.Ming-Shiann Feng...”
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  19. 19
    Application of high temperature deposited Aluminum gate electrode on the fabrication of a-Si TFT
    by Chen, Shih-Ming, 陳世明
    Published 1997
    Other Authors: “...Ming-Shiann Feng, Ting-Chang Chang...”
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  20. 20
    Chemical-Mechanical Polishing of Low Dielectric Constant Spin-On Glass Thin Films
    by Chang, Shih-Tzung, 張仕宗
    Published 1997
    Other Authors: “...Ming-Shiann Feng, Bau-Tong Dai...”
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