Thermal Stability of Ultrafine Grained Pure Copper Prepared by Large Strain Extrusion Machining
Ultrafine grained (UFG) pure copper chips with improved material strength have been successfully prepared by large strain extrusion machining (LSEM). However, the thermal stability of the UFG chips has been a key characteristic that has restricted their use in practical applications. To understand t...
|Main Authors:||, , , ,|