Thermal Stability of Ultrafine Grained Pure Copper Prepared by Large Strain Extrusion Machining

Ultrafine grained (UFG) pure copper chips with improved material strength have been successfully prepared by large strain extrusion machining (LSEM). However, the thermal stability of the UFG chips has been a key characteristic that has restricted their use in practical applications. To understand t...

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Bibliographic Details
Main Authors: Bangxian Wu, Bin Chen, Zhijie Zou, Shaofeng Liao, Wenjun Deng
Format: Article
Published: MDPI AG 2018-05-01
Online Access: