Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
The influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2016-11-01
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| Series: | Science and Engineering of Composite Materials |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/secm-2014-0130 |