Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module

Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was...

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Bibliographic Details
Main Authors: Libin Lu, Zhen Zhang, Yingchun Guan, Hongyu Zheng
Format: Article
Language:English
Published: MDPI AG 2018-08-01
Series:Polymers
Subjects:
Online Access:http://www.mdpi.com/2073-4360/10/8/886