Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module
Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2018-08-01
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Series: | Polymers |
Subjects: | |
Online Access: | http://www.mdpi.com/2073-4360/10/8/886 |