Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review
The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques su...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-07-01
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| Series: | Coatings |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2079-6412/8/8/262 |