Photocatalytic Surface Modification of PI Film for Electroless Copper Plating
This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2018-01-01
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| Series: | Advances in Condensed Matter Physics |
| Online Access: | http://dx.doi.org/10.1155/2018/1619581 |