Chip Appearance Inspection Method for High-Precision SMT Equipment
In order to meet the defect-detection requirements of chips in high-precision surface mount technology (SMT) equipment widely used in the electronic industry, a chip appearance defect-detection method based on multi-order fractional discrete wavelet packet decomposition (DWPD) is proposed in this pa...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-02-01
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| Series: | Machines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-1702/9/2/34 |