Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper
The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-04-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/11/4/624 |