Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites...

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Main Authors: Zhengdong Wang, Xiaozhuo Wang, Silong Wang, Jieyu He, Tong Zhang, Juan Wang, Guanglei Wu
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/11/8/1898
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spelling doaj-86dd39b07f974eabbd9d1ebb2d5fea712021-08-26T14:08:43ZengMDPI AGNanomaterials2079-49912021-07-01111898189810.3390/nano11081898Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy CompositesZhengdong Wang0Xiaozhuo Wang1Silong Wang2Jieyu He3Tong Zhang4Juan Wang5Guanglei Wu6School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaState Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao University, Qingdao 266071, ChinaPolymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.https://www.mdpi.com/2079-4991/11/8/1898sandwich epoxy-based compositesaluminium nitridedielectric propertiesthermal conductivity
collection DOAJ
language English
format Article
sources DOAJ
author Zhengdong Wang
Xiaozhuo Wang
Silong Wang
Jieyu He
Tong Zhang
Juan Wang
Guanglei Wu
spellingShingle Zhengdong Wang
Xiaozhuo Wang
Silong Wang
Jieyu He
Tong Zhang
Juan Wang
Guanglei Wu
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
Nanomaterials
sandwich epoxy-based composites
aluminium nitride
dielectric properties
thermal conductivity
author_facet Zhengdong Wang
Xiaozhuo Wang
Silong Wang
Jieyu He
Tong Zhang
Juan Wang
Guanglei Wu
author_sort Zhengdong Wang
title Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
title_short Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
title_full Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
title_fullStr Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
title_full_unstemmed Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
title_sort simultaneously enhanced thermal conductivity and dielectric breakdown strength in sandwich aln/epoxy composites
publisher MDPI AG
series Nanomaterials
issn 2079-4991
publishDate 2021-07-01
description Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.
topic sandwich epoxy-based composites
aluminium nitride
dielectric properties
thermal conductivity
url https://www.mdpi.com/2079-4991/11/8/1898
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AT xiaozhuowang simultaneouslyenhancedthermalconductivityanddielectricbreakdownstrengthinsandwichalnepoxycomposites
AT silongwang simultaneouslyenhancedthermalconductivityanddielectricbreakdownstrengthinsandwichalnepoxycomposites
AT jieyuhe simultaneouslyenhancedthermalconductivityanddielectricbreakdownstrengthinsandwichalnepoxycomposites
AT tongzhang simultaneouslyenhancedthermalconductivityanddielectricbreakdownstrengthinsandwichalnepoxycomposites
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