Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites
Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites...
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doaj-86dd39b07f974eabbd9d1ebb2d5fea712021-08-26T14:08:43ZengMDPI AGNanomaterials2079-49912021-07-01111898189810.3390/nano11081898Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy CompositesZhengdong Wang0Xiaozhuo Wang1Silong Wang2Jieyu He3Tong Zhang4Juan Wang5Guanglei Wu6School of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaSchool of Mechanical and Electrical Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, ChinaState Key Laboratory of Bio-Fibers and Eco-Textiles, Institute of Materials for Energy and Environment, College of Materials Science and Engineering, Qingdao University, Qingdao 266071, ChinaPolymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.https://www.mdpi.com/2079-4991/11/8/1898sandwich epoxy-based compositesaluminium nitridedielectric propertiesthermal conductivity |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Zhengdong Wang Xiaozhuo Wang Silong Wang Jieyu He Tong Zhang Juan Wang Guanglei Wu |
spellingShingle |
Zhengdong Wang Xiaozhuo Wang Silong Wang Jieyu He Tong Zhang Juan Wang Guanglei Wu Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites Nanomaterials sandwich epoxy-based composites aluminium nitride dielectric properties thermal conductivity |
author_facet |
Zhengdong Wang Xiaozhuo Wang Silong Wang Jieyu He Tong Zhang Juan Wang Guanglei Wu |
author_sort |
Zhengdong Wang |
title |
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites |
title_short |
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites |
title_full |
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites |
title_fullStr |
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites |
title_full_unstemmed |
Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites |
title_sort |
simultaneously enhanced thermal conductivity and dielectric breakdown strength in sandwich aln/epoxy composites |
publisher |
MDPI AG |
series |
Nanomaterials |
issn |
2079-4991 |
publishDate |
2021-07-01 |
description |
Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment. |
topic |
sandwich epoxy-based composites aluminium nitride dielectric properties thermal conductivity |
url |
https://www.mdpi.com/2079-4991/11/8/1898 |
work_keys_str_mv |
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