Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
Constant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inli...
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doaj-876b714310a14a6bb666889dc309fd552021-07-05T23:00:09ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01963363910.1109/JEDS.2021.30918989463426Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETsTianshi Liu0https://orcid.org/0000-0003-0502-0097Shengnan Zhu1Marvin H. White2Arash Salemi3https://orcid.org/0000-0002-7510-9639David Sheridan4Anant K. Agarwal5Department of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USAPower District, Alpha and Omega Semiconductor, Sunnyvale, CA, USAPower District, Alpha and Omega Semiconductor, Sunnyvale, CA, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USAConstant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inline-formula> <tex-math notation="LaTeX">$\gamma $ </tex-math></inline-formula>) are observed at oxide electric fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}$ </tex-math></inline-formula>) around 8.5 MV/cm to 9 MV/cm for all commercial MOSFETs. Gate leakage currents and threshold voltage shifts are also monitored under different oxide fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {8 MV/cm}}$ </tex-math></inline-formula> and 10 MV/cm). The results suggest the failure mode under high oxide electric field is modified by impact ionization or Anode Hole Injection (AHI) induced hole trapping. This observation agrees with previously published oxide reliability studies on SiC MOSFETs and suggests that constant-voltage TDDB measurements need to be carefully performed under low oxide fields to avoid lifetime overestimation caused by hole trapping. The extrapolated <inline-formula> <tex-math notation="LaTeX">$t_{63\%}$ </tex-math></inline-formula> lifetimes (times to 63% failures) from TDDB measurements performed at <inline-formula> <tex-math notation="LaTeX">$E_{ox} < {\mathrm {8.5 MV/cm}}$ </tex-math></inline-formula> are longer than 10<sup>8</sup> hours at 150°C for all vendors. The predicted lifetimes at <inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {4 MV/cm}}$ </tex-math></inline-formula> demonstrate more than 10<sup>5</sup> times increases than the oxide lifetimes reported a decade ago, showing promising progress in SiC technology.https://ieeexplore.ieee.org/document/9463426/Electron and hole trappingimpact ionizationgate oxide reliabilitylifetimesilicon carbide (SiC) power MOSFETstime-dependent dielectric breakdown (TDDB) |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Tianshi Liu Shengnan Zhu Marvin H. White Arash Salemi David Sheridan Anant K. Agarwal |
spellingShingle |
Tianshi Liu Shengnan Zhu Marvin H. White Arash Salemi David Sheridan Anant K. Agarwal Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs IEEE Journal of the Electron Devices Society Electron and hole trapping impact ionization gate oxide reliability lifetime silicon carbide (SiC) power MOSFETs time-dependent dielectric breakdown (TDDB) |
author_facet |
Tianshi Liu Shengnan Zhu Marvin H. White Arash Salemi David Sheridan Anant K. Agarwal |
author_sort |
Tianshi Liu |
title |
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs |
title_short |
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs |
title_full |
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs |
title_fullStr |
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs |
title_full_unstemmed |
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs |
title_sort |
time-dependent dielectric breakdown of commercial 1.2 kv 4h-sic power mosfets |
publisher |
IEEE |
series |
IEEE Journal of the Electron Devices Society |
issn |
2168-6734 |
publishDate |
2021-01-01 |
description |
Constant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inline-formula> <tex-math notation="LaTeX">$\gamma $ </tex-math></inline-formula>) are observed at oxide electric fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}$ </tex-math></inline-formula>) around 8.5 MV/cm to 9 MV/cm for all commercial MOSFETs. Gate leakage currents and threshold voltage shifts are also monitored under different oxide fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {8 MV/cm}}$ </tex-math></inline-formula> and 10 MV/cm). The results suggest the failure mode under high oxide electric field is modified by impact ionization or Anode Hole Injection (AHI) induced hole trapping. This observation agrees with previously published oxide reliability studies on SiC MOSFETs and suggests that constant-voltage TDDB measurements need to be carefully performed under low oxide fields to avoid lifetime overestimation caused by hole trapping. The extrapolated <inline-formula> <tex-math notation="LaTeX">$t_{63\%}$ </tex-math></inline-formula> lifetimes (times to 63% failures) from TDDB measurements performed at <inline-formula> <tex-math notation="LaTeX">$E_{ox} < {\mathrm {8.5 MV/cm}}$ </tex-math></inline-formula> are longer than 10<sup>8</sup> hours at 150°C for all vendors. The predicted lifetimes at <inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {4 MV/cm}}$ </tex-math></inline-formula> demonstrate more than 10<sup>5</sup> times increases than the oxide lifetimes reported a decade ago, showing promising progress in SiC technology. |
topic |
Electron and hole trapping impact ionization gate oxide reliability lifetime silicon carbide (SiC) power MOSFETs time-dependent dielectric breakdown (TDDB) |
url |
https://ieeexplore.ieee.org/document/9463426/ |
work_keys_str_mv |
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