Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs

Constant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inli...

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Main Authors: Tianshi Liu, Shengnan Zhu, Marvin H. White, Arash Salemi, David Sheridan, Anant K. Agarwal
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9463426/
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spelling doaj-876b714310a14a6bb666889dc309fd552021-07-05T23:00:09ZengIEEEIEEE Journal of the Electron Devices Society2168-67342021-01-01963363910.1109/JEDS.2021.30918989463426Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETsTianshi Liu0https://orcid.org/0000-0003-0502-0097Shengnan Zhu1Marvin H. White2Arash Salemi3https://orcid.org/0000-0002-7510-9639David Sheridan4Anant K. Agarwal5Department of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USAPower District, Alpha and Omega Semiconductor, Sunnyvale, CA, USAPower District, Alpha and Omega Semiconductor, Sunnyvale, CA, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH, USAConstant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inline-formula> <tex-math notation="LaTeX">$\gamma $ </tex-math></inline-formula>) are observed at oxide electric fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}$ </tex-math></inline-formula>) around 8.5 MV/cm to 9 MV/cm for all commercial MOSFETs. Gate leakage currents and threshold voltage shifts are also monitored under different oxide fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {8 MV/cm}}$ </tex-math></inline-formula> and 10 MV/cm). The results suggest the failure mode under high oxide electric field is modified by impact ionization or Anode Hole Injection (AHI) induced hole trapping. This observation agrees with previously published oxide reliability studies on SiC MOSFETs and suggests that constant-voltage TDDB measurements need to be carefully performed under low oxide fields to avoid lifetime overestimation caused by hole trapping. The extrapolated <inline-formula> <tex-math notation="LaTeX">$t_{63\%}$ </tex-math></inline-formula> lifetimes (times to 63&#x0025; failures) from TDDB measurements performed at <inline-formula> <tex-math notation="LaTeX">$E_{ox} &lt; {\mathrm {8.5 MV/cm}}$ </tex-math></inline-formula> are longer than 10<sup>8</sup> hours at 150&#x00B0;C for all vendors. The predicted lifetimes at <inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {4 MV/cm}}$ </tex-math></inline-formula> demonstrate more than 10<sup>5</sup> times increases than the oxide lifetimes reported a decade ago, showing promising progress in SiC technology.https://ieeexplore.ieee.org/document/9463426/Electron and hole trappingimpact ionizationgate oxide reliabilitylifetimesilicon carbide (SiC) power MOSFETstime-dependent dielectric breakdown (TDDB)
collection DOAJ
language English
format Article
sources DOAJ
author Tianshi Liu
Shengnan Zhu
Marvin H. White
Arash Salemi
David Sheridan
Anant K. Agarwal
spellingShingle Tianshi Liu
Shengnan Zhu
Marvin H. White
Arash Salemi
David Sheridan
Anant K. Agarwal
Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
IEEE Journal of the Electron Devices Society
Electron and hole trapping
impact ionization
gate oxide reliability
lifetime
silicon carbide (SiC) power MOSFETs
time-dependent dielectric breakdown (TDDB)
author_facet Tianshi Liu
Shengnan Zhu
Marvin H. White
Arash Salemi
David Sheridan
Anant K. Agarwal
author_sort Tianshi Liu
title Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
title_short Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
title_full Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
title_fullStr Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
title_full_unstemmed Time-Dependent Dielectric Breakdown of Commercial 1.2 kV 4H-SiC Power MOSFETs
title_sort time-dependent dielectric breakdown of commercial 1.2 kv 4h-sic power mosfets
publisher IEEE
series IEEE Journal of the Electron Devices Society
issn 2168-6734
publishDate 2021-01-01
description Constant-voltage time-dependent dielectric breakdown (TDDB) measurements are performed on recently manufactured commercial 1.2 kV 4H-SiC power metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs) from three vendors. Abrupt changes of the electric field acceleration parameters (<inline-formula> <tex-math notation="LaTeX">$\gamma $ </tex-math></inline-formula>) are observed at oxide electric fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}$ </tex-math></inline-formula>) around 8.5 MV/cm to 9 MV/cm for all commercial MOSFETs. Gate leakage currents and threshold voltage shifts are also monitored under different oxide fields (<inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {8 MV/cm}}$ </tex-math></inline-formula> and 10 MV/cm). The results suggest the failure mode under high oxide electric field is modified by impact ionization or Anode Hole Injection (AHI) induced hole trapping. This observation agrees with previously published oxide reliability studies on SiC MOSFETs and suggests that constant-voltage TDDB measurements need to be carefully performed under low oxide fields to avoid lifetime overestimation caused by hole trapping. The extrapolated <inline-formula> <tex-math notation="LaTeX">$t_{63\%}$ </tex-math></inline-formula> lifetimes (times to 63&#x0025; failures) from TDDB measurements performed at <inline-formula> <tex-math notation="LaTeX">$E_{ox} &lt; {\mathrm {8.5 MV/cm}}$ </tex-math></inline-formula> are longer than 10<sup>8</sup> hours at 150&#x00B0;C for all vendors. The predicted lifetimes at <inline-formula> <tex-math notation="LaTeX">$E_{ox}= {\mathrm {4 MV/cm}}$ </tex-math></inline-formula> demonstrate more than 10<sup>5</sup> times increases than the oxide lifetimes reported a decade ago, showing promising progress in SiC technology.
topic Electron and hole trapping
impact ionization
gate oxide reliability
lifetime
silicon carbide (SiC) power MOSFETs
time-dependent dielectric breakdown (TDDB)
url https://ieeexplore.ieee.org/document/9463426/
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