Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics
Insulating materials combining a high mechanical stability, a low dielectric constant and the ability to completely fill narrow gaps are essential to fabricate interconnects for future high-performance chips. Here, the authors integrate zeolitic imidazolate frameworks as ultra-low-k dielectrics with...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2019-08-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-019-11703-x |