Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.

Bibliographic Details
Main Authors: Arne Quellmalz, Xiaojing Wang, Simon Sawallich, Burkay Uzlu, Martin Otto, Stefan Wagner, Zhenxing Wang, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Georg S. Duesberg, Max C. Lemme, Kristinn B. Gylfason, Niclas Roxhed, Göran Stemme, Frank Niklaus
Format: Article
Language:English
Published: Nature Publishing Group 2021-02-01
Series:Nature Communications
Online Access:https://doi.org/10.1038/s41467-021-21136-0
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spelling doaj-8af99583e0ae4934b663750930c1b9232021-02-14T12:12:41ZengNature Publishing GroupNature Communications2041-17232021-02-0112111110.1038/s41467-021-21136-0Large-area integration of two-dimensional materials and their heterostructures by wafer bondingArne Quellmalz0Xiaojing Wang1Simon Sawallich2Burkay Uzlu3Martin Otto4Stefan Wagner5Zhenxing Wang6Maximilian Prechtl7Oliver Hartwig8Siwei Luo9Georg S. Duesberg10Max C. Lemme11Kristinn B. Gylfason12Niclas Roxhed13Göran Stemme14Frank Niklaus15Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyDivision of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyProtemics GmbHChair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen UniversityAMO GmbH, Advanced Microelectronic Center Aachen (AMICA)AMO GmbH, Advanced Microelectronic Center Aachen (AMICA)AMO GmbH, Advanced Microelectronic Center Aachen (AMICA)Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr MünchenInstitute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr MünchenInstitute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr MünchenInstitute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr MünchenChair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen UniversityDivision of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyDivision of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyDivision of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyDivision of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of TechnologyThe existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.https://doi.org/10.1038/s41467-021-21136-0
collection DOAJ
language English
format Article
sources DOAJ
author Arne Quellmalz
Xiaojing Wang
Simon Sawallich
Burkay Uzlu
Martin Otto
Stefan Wagner
Zhenxing Wang
Maximilian Prechtl
Oliver Hartwig
Siwei Luo
Georg S. Duesberg
Max C. Lemme
Kristinn B. Gylfason
Niclas Roxhed
Göran Stemme
Frank Niklaus
spellingShingle Arne Quellmalz
Xiaojing Wang
Simon Sawallich
Burkay Uzlu
Martin Otto
Stefan Wagner
Zhenxing Wang
Maximilian Prechtl
Oliver Hartwig
Siwei Luo
Georg S. Duesberg
Max C. Lemme
Kristinn B. Gylfason
Niclas Roxhed
Göran Stemme
Frank Niklaus
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
Nature Communications
author_facet Arne Quellmalz
Xiaojing Wang
Simon Sawallich
Burkay Uzlu
Martin Otto
Stefan Wagner
Zhenxing Wang
Maximilian Prechtl
Oliver Hartwig
Siwei Luo
Georg S. Duesberg
Max C. Lemme
Kristinn B. Gylfason
Niclas Roxhed
Göran Stemme
Frank Niklaus
author_sort Arne Quellmalz
title Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
title_short Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
title_full Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
title_fullStr Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
title_full_unstemmed Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
title_sort large-area integration of two-dimensional materials and their heterostructures by wafer bonding
publisher Nature Publishing Group
series Nature Communications
issn 2041-1723
publishDate 2021-02-01
description The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.
url https://doi.org/10.1038/s41467-021-21136-0
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