Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea
Apartment buildings are the most common housing typology in South Korea. The mass construction of apartment neighborhoods during a period of rapid economic growth (1970−1997) involved the minimization of material use and quality, as well as industrialized construction processes. Accordingl...
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doaj-9f3dc2abc19743d888d8dcac411d04cc2020-11-25T01:02:27ZengMDPI AGSustainability2071-10502019-07-011114395010.3390/su11143950su11143950Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, KoreaFabrizio M. Amoruso0Udo Dietrich1Thorsten Schuetze2Department of Architecture, College of Engineering, SungKyunKwan University, 2066 Seobu-ru Jangan-gu, Suwon-si 440-746, KoreaDepartment of Building Physics, HafenCity University, Ueberseeallee 16, 20457 Hamburg, GermanyDepartment of Architecture, College of Engineering, SungKyunKwan University, 2066 Seobu-ru Jangan-gu, Suwon-si 440-746, KoreaApartment buildings are the most common housing typology in South Korea. The mass construction of apartment neighborhoods during a period of rapid economic growth (1970−1997) involved the minimization of material use and quality, as well as industrialized construction processes. Accordingly, apartment buildings require essential renovation after only 20 years of operation. This study focuses on the improvement of thermal comfort for the renovation of an exemplary apartment building based on an integrated Building Information Modeling (BIM) and parametric software framework. The existing apartment was reconstructed with BIM software, and the virtual model was utilized for a parametric building energy simulation to calculate the thermal comfort condition of occupants during the entire year. The thermal comfort analysis results defined the criteria for the development of an enhanced building envelope system characterized by modular panels. The parametric energy simulation was executed for the renovated apartment condition with the enhanced envelope system, and the thermal comfort improvements were quantified by comparing the results for the apartment condition before and after renovation. This study aims to provide the tools and criteria for the comfort analysis of apartment occupants, as well as propose sustainable solutions for the improvement of thermal comfort in aged buildings with similar conditions, internal distribution, and construction components.https://www.mdpi.com/2071-1050/11/14/3950thermal comfort analysissustainable building renovationenhanced building envelope systemBIM-parametric refurbishment workflow |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Fabrizio M. Amoruso Udo Dietrich Thorsten Schuetze |
spellingShingle |
Fabrizio M. Amoruso Udo Dietrich Thorsten Schuetze Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea Sustainability thermal comfort analysis sustainable building renovation enhanced building envelope system BIM-parametric refurbishment workflow |
author_facet |
Fabrizio M. Amoruso Udo Dietrich Thorsten Schuetze |
author_sort |
Fabrizio M. Amoruso |
title |
Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea |
title_short |
Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea |
title_full |
Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea |
title_fullStr |
Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea |
title_full_unstemmed |
Indoor Thermal Comfort Improvement through the Integrated BIM-Parametric Workflow-Based Sustainable Renovation of an Exemplary Apartment in Seoul, Korea |
title_sort |
indoor thermal comfort improvement through the integrated bim-parametric workflow-based sustainable renovation of an exemplary apartment in seoul, korea |
publisher |
MDPI AG |
series |
Sustainability |
issn |
2071-1050 |
publishDate |
2019-07-01 |
description |
Apartment buildings are the most common housing typology in South Korea. The mass construction of apartment neighborhoods during a period of rapid economic growth (1970−1997) involved the minimization of material use and quality, as well as industrialized construction processes. Accordingly, apartment buildings require essential renovation after only 20 years of operation. This study focuses on the improvement of thermal comfort for the renovation of an exemplary apartment building based on an integrated Building Information Modeling (BIM) and parametric software framework. The existing apartment was reconstructed with BIM software, and the virtual model was utilized for a parametric building energy simulation to calculate the thermal comfort condition of occupants during the entire year. The thermal comfort analysis results defined the criteria for the development of an enhanced building envelope system characterized by modular panels. The parametric energy simulation was executed for the renovated apartment condition with the enhanced envelope system, and the thermal comfort improvements were quantified by comparing the results for the apartment condition before and after renovation. This study aims to provide the tools and criteria for the comfort analysis of apartment occupants, as well as propose sustainable solutions for the improvement of thermal comfort in aged buildings with similar conditions, internal distribution, and construction components. |
topic |
thermal comfort analysis sustainable building renovation enhanced building envelope system BIM-parametric refurbishment workflow |
url |
https://www.mdpi.com/2071-1050/11/14/3950 |
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