Electrodeposition of aluminium–copper alloy from 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) imide

Electrodeposition of aluminium–copper alloy from 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) imide

This work studies the electrodeposition of aluminium–copper alloy on highly pure gold substrates in 1-butyl-1-methylpyrrolidinium bis(trifluoromethyl-sulfonyl) imide ([BMP]Tf2N) ionic liquid. The investigations were carried out using the white viscous upper phase of AlCl3 based [BMP]Tf2N mixture whi...

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Bibliographic Details
Main Author: Amr S. Ismail
Format: Article
Language:English
Published: Elsevier 2017-03-01
Series:Egyptian Journal of Petroleum
Subjects:
Aluminium–copper alloys
Tf2N
Electrodeposition
Ionic liquid
Online Access:http://www.sciencedirect.com/science/article/pii/S1110062115300428

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http://www.sciencedirect.com/science/article/pii/S1110062115300428

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