Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration

The crystallographic characteristic effect of Cu substrate on cathode dissolution behavior in line-type Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints during electromigration (EM) was investigated by scanning electron microscope (SEM), electron backscatter diffraction (EBSD), and first-principles calcu...

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Bibliographic Details
Main Authors: Wu Yue, Chao Ding, Hongbo Qin, Chenggong Gong, Junxi Zhang
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/10/2486