EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES
The Lead-free solder has been subject of concentrated research activity over the past era, but it is hard to meet the characterization and mechanical properties of Sn-Pb solder. Sn-Ag-Cu and Sn-Cu family of alloys were the most ideal and capable among all the Pb-free solder alloys proposed. Much pub...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehnium Publishing House
2019-03-01
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| Series: | European Journal of Materials Science and Engineering |
| Subjects: | |
| Online Access: | http://ejmse.tuiasi.ro/articles/EJMSE_04_01_05_Mahim.pdf |