Effect of Stirring on the Defect-Free Filling of Deep Through-Silicon Vias
Through-silicon-via (TSV) is an advanced 3D electronic integration technology. In order to achieve the defect-free filling of deep TSV, forced convection is commonly applied during TSV filling process. In this study, the interaction effect of forced convection and current density on deep TSV filling...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9079798/ |