High Bonding Temperatures Greatly Improve Soy Adhesive Wet Strength
Soy wood adhesive bond strengths reported in different literature studies are difficult to compare because a variety of temperatures and other conditions have been used for the bonding and testing step. Some reports have indicated bond strengths are sensitive to bonding temperature, but the reason(s...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2016-11-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2073-4360/8/11/394 |