The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

The influence of Bi, as foreign metal atoms in anode copper, on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate solution was investigated using the galvanostatic single-pulse method. Results indicate that presence of Bi atoms in anode copper increases...

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Bibliographic Details
Main Authors: Stanković Zvonimir D., Cvetkovski Vladimir B., Grekulović Vesna J.
Format: Article
Language:English
Published: Association of Chemical Engineers of Serbia 2010-01-01
Series:Hemijska Industrija
Subjects:
Online Access:http://www.doiserbia.nb.rs/img/doi/0367-598X/2010/0367-598X1000021S.pdf