Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel
To eliminate the deep scratches on the 4H-SiC wafer surface in the grinding process, a PVA/PF composite sol-gel diamond wheel was proposed. Diamond and fillers are sheared and dispersed in the polyvinyl alcohol-phenolic resin composite sol glue, repeatedly frozen at a low temperature of −20°C to gel...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2021-09-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/16878140211044929 |