Research on influences of contact force in chemical mechanical polishing (CMP) process

A series of simulations of chemical mechanical polishing (CMP) were conducted to investigate the contact force between abrasive particles and specimens by using the finite element method (FEM). In this paper, a micro-contact model, which only involves the mechanical interactions, was set up to simul...

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Bibliographic Details
Main Authors: Lei Han, Hongwei Zhao, Qixun Zhang, Mingjun Jin, Lin Zhang, Peng Zhang
Format: Article
Language:English
Published: AIP Publishing LLC 2015-04-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.4903700