APA (7th ed.) Citation

Lee, K., Woo, S., Kim, S. B., Lee, S., Park, L., & Park, K. (2020). Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion. Elsevier.

Chicago Style (17th ed.) Citation

Lee, Keunho, Sanghyun Woo, Seok Bong Kim, Seong Lee, Leeju Park, and Kyung-Tae Park. Deformation and Microstructural Evolution of Ultrafine- and Fine-grained OFHC Cu During Dynamic Tensile Extrusion. Elsevier, 2020.

MLA (8th ed.) Citation

Lee, Keunho, et al. Deformation and Microstructural Evolution of Ultrafine- and Fine-grained OFHC Cu During Dynamic Tensile Extrusion. Elsevier, 2020.