Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion

The deformation behavior and microstructural evolution of ultrafine- (UFG) and fine-grained (FG) Cu during the dynamic tensile extrusion (DTE) process were investigated. The DTE tests were conducted with identical projectile velocities using an all-vacuum gas gun. The DTE ductility increases as the...

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Main Authors: Keunho Lee, Sanghyun Woo, Seok Bong Kim, Seong Lee, Leeju Park, Kyung-Tae Park
Format: Article
Language:English
Published: Elsevier 2020-09-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S223878542031588X
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spelling doaj-ede2615c8e844944b8cc5095cb5b7e572020-11-25T03:55:46ZengElsevierJournal of Materials Research and Technology2238-78542020-09-01951074610757Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusionKeunho Lee0Sanghyun Woo1Seok Bong Kim2Seong Lee3Leeju Park4Kyung-Tae Park5Agency for Defense Development, P.O. Box 35-42, Daejeon 34186, Republic of Korea; Corresponding author.Agency for Defense Development, P.O. Box 35-42, Daejeon 34186, Republic of Korea; Weapon systems engineering, University of science and technology, Daejeon 34113, Republic of KoreaAgency for Defense Development, P.O. Box 35-42, Daejeon 34186, Republic of KoreaAgency for Defense Development, P.O. Box 35-42, Daejeon 34186, Republic of KoreaAgency for Defense Development, P.O. Box 35-42, Daejeon 34186, Republic of Korea; Weapon systems engineering, University of science and technology, Daejeon 34113, Republic of KoreaDepartment of Materials Science and Engineering, Hanbat National University, Daejeon 34158, Republic of KoreaThe deformation behavior and microstructural evolution of ultrafine- (UFG) and fine-grained (FG) Cu during the dynamic tensile extrusion (DTE) process were investigated. The DTE tests were conducted with identical projectile velocities using an all-vacuum gas gun. The DTE ductility increases as the grain size increases, in contrast to the previous outcome with coarse-grained Cu exhibiting that the ductility increased with a decrease in the grain size. The fragments were softly recovered and were examined by a micro-Vickers hardness test and microstructural characterization assessments. The hardness profiles of the fragments exhibit a drastic decrease in the UFG-B remnant, while hardness variations are found in the middle fragments for FG-200. A strong dual <001> + <111> texture is developed during the DTE regardless of the UFG and FG sizes. The UFG-B fragments show that the <111> fibers are replaced by the <001> fibers as a result of meta-dynamic recrystallization (mDRX), while the <111> fibers in FG-200 saturate without any extensive reduction. Evidence of the mDRX was found in an analysis of the misorientation-angle distribution, grain morphology, and grain orientation spread. A numerical simulation reveals that the mDRX can occur due to adiabatic heating, with the faster kinetics in the UFG-B originated from the accumulation of higher levels of deformation energy during the DTE process. The present study also confirms that occurrence of mDRX in the UFG and FG Cu triggers a ductile failure and local necking with a decrease in the DTE ductility.http://www.sciencedirect.com/science/article/pii/S223878542031588XDynamic tensile extrusionCopperUltrafine grainsDynamic recrystallizationMicrostructure
collection DOAJ
language English
format Article
sources DOAJ
author Keunho Lee
Sanghyun Woo
Seok Bong Kim
Seong Lee
Leeju Park
Kyung-Tae Park
spellingShingle Keunho Lee
Sanghyun Woo
Seok Bong Kim
Seong Lee
Leeju Park
Kyung-Tae Park
Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
Journal of Materials Research and Technology
Dynamic tensile extrusion
Copper
Ultrafine grains
Dynamic recrystallization
Microstructure
author_facet Keunho Lee
Sanghyun Woo
Seok Bong Kim
Seong Lee
Leeju Park
Kyung-Tae Park
author_sort Keunho Lee
title Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
title_short Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
title_full Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
title_fullStr Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
title_full_unstemmed Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
title_sort deformation and microstructural evolution of ultrafine- and fine-grained ofhc cu during dynamic tensile extrusion
publisher Elsevier
series Journal of Materials Research and Technology
issn 2238-7854
publishDate 2020-09-01
description The deformation behavior and microstructural evolution of ultrafine- (UFG) and fine-grained (FG) Cu during the dynamic tensile extrusion (DTE) process were investigated. The DTE tests were conducted with identical projectile velocities using an all-vacuum gas gun. The DTE ductility increases as the grain size increases, in contrast to the previous outcome with coarse-grained Cu exhibiting that the ductility increased with a decrease in the grain size. The fragments were softly recovered and were examined by a micro-Vickers hardness test and microstructural characterization assessments. The hardness profiles of the fragments exhibit a drastic decrease in the UFG-B remnant, while hardness variations are found in the middle fragments for FG-200. A strong dual <001> + <111> texture is developed during the DTE regardless of the UFG and FG sizes. The UFG-B fragments show that the <111> fibers are replaced by the <001> fibers as a result of meta-dynamic recrystallization (mDRX), while the <111> fibers in FG-200 saturate without any extensive reduction. Evidence of the mDRX was found in an analysis of the misorientation-angle distribution, grain morphology, and grain orientation spread. A numerical simulation reveals that the mDRX can occur due to adiabatic heating, with the faster kinetics in the UFG-B originated from the accumulation of higher levels of deformation energy during the DTE process. The present study also confirms that occurrence of mDRX in the UFG and FG Cu triggers a ductile failure and local necking with a decrease in the DTE ductility.
topic Dynamic tensile extrusion
Copper
Ultrafine grains
Dynamic recrystallization
Microstructure
url http://www.sciencedirect.com/science/article/pii/S223878542031588X
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