Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion

The deformation behavior and microstructural evolution of ultrafine- (UFG) and fine-grained (FG) Cu during the dynamic tensile extrusion (DTE) process were investigated. The DTE tests were conducted with identical projectile velocities using an all-vacuum gas gun. The DTE ductility increases as the...

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Bibliographic Details
Main Authors: Keunho Lee, Sanghyun Woo, Seok Bong Kim, Seong Lee, Leeju Park, Kyung-Tae Park
Format: Article
Language:English
Published: Elsevier 2020-09-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S223878542031588X