Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joint...

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Bibliographic Details
Main Authors: Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Siti Farahnabilah Muhd Amli, Rita Mohd Said, Norainiza Saud, Mohd Mustafa Al Bakri Abdullah, Petrica Vizureanu, Adam Rylski, Jitrin Chaiprapa, Marcin Nabialek
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Materials
Subjects:
bismuth
intermetallic compound
IMC thickness
mechanical properties
isothermal annealing
Online Access:https://www.mdpi.com/1996-1944/14/18/5134

Internet

https://www.mdpi.com/1996-1944/14/18/5134

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