Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review
As to promote the performance of the solder joints applied to electronics industry, the researchers take advantage of micro/nano-sized particles or another element coated on nanoparticles to be incorporated into the solder paste or flux and investigate their microstructure and properties. Based on r...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-01-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127520307590 |