Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices

Accurate alignment between the cavities in cavity-SOI (c-SOI) wafers and lithography on the wafer surface is essential to advanced MEMS production. Existing alignment methods are well defined, but often require specialized equipment or costly software packages available only in professional manufact...

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Bibliographic Details
Main Authors: Christopher Mountain, Marta Kluba, Lambert Bergers, Jaap Snijder, Ronald Dekker
Format: Article
Language:English
Published: Elsevier 2019-12-01
Series:Micro and Nano Engineering
Online Access:http://www.sciencedirect.com/science/article/pii/S2590007219300292