Pixel-less and Pixel-lated Inorganic/Organic Hybrid Infrared Imaging Upconversion Devices
Nowadays, the industrial standard for infrared imaging systems is to interconnect an infrared photodetector array with a silicon-based read-out-integrated circuit pixel by pixel through existing indium bumping technology for infrared scene detection and then the signal is output optically through a...
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| Language: | en |
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2013
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| Online Access: | http://hdl.handle.net/10012/7227 |