Packaging solution for VLSI electronic photonic chips

Packaging solution for VLSI electronic photonic chips

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007. === Includes bibliographical references. === As the demand of information capacity grows, the adoption of optical technology will increase. The issue of resistance and capacitance is limiting t...

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Bibliographic Details
Main Author: Lee, Chieh-feng
Other Authors: Lionel C. Kimerling.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2008
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/42155

Internet

http://hdl.handle.net/1721.1/42155

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