Kinetics modeling and 3-dimensional simulation of surface roughness during plasma etching
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 2009. === Includes bibliographical references. === The control of feature profiles in directional plasma etching processes is crucial as critical dimension, line-edge roughening, and other artifacts affect device...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1721.1/46600 |