Thermally Conductive Polymer Composites for Electronic Packaging Applications
Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are bec...
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| Language: | en_ca |
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2012
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| Online Access: | http://hdl.handle.net/1807/32473 |