無電鍍鎳層組織的探討

• Main Author: 賴柏仁
• Other Authors: 林光隆
• Format: Others
• Language: zh-TW
• Published: 1988
• Online Access: http://ndltd.ncl.edu.tw/handle/44678298524939577252

碩士 === 國立成功大學 === 礦冶及材料科學研究所 === 76 === This study is to investigate the surface morphology, crystal structure and the elemental distribution in the as-deposited and heat-treated electroless Ni-P plating. It is also tried to investigate the interdiffusion behavior between the carbon steel substrate and the plating layer. Additionally, the distribution of alumina particles in the as-deposited and heat-treated composite eletroless nickel plating layer is also investigated. In the current work it is observed through TEM that the crystallization behavior of the as-deposited amorphous plating results in distinct Ni and Ni3P crystals, which are prominent at higher temperature. The results of the XRD and TEM analysis along with the microhardness variation data tell that the well known maximum hardness trend is resulted from the crystallization and crystal growth of the plating layer. The heat treatment at higher temperature, greater than 600℃, in one hour give rise to prominent diffusion layer between the substrate and plating layer. The interdiffusivity was found through the measurement of interdiffusivity to take place through grain boundary diffusion at lower temperature, while it takes place through volume diffusion greater than 700℃. The codeposited alumina particles do not cause significant change in the microhardness of the plating layer. The particles was found to be located between the grains or mounted within the grains after heat treatment.