Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors

碩士 === 國立清華大學 === 電機工程學系 === 85 === Abstract There are two major parts in this thesis. One is to calibrate the newly setup SEM lithography system and to apply it to the fabrication of submicron Metal-Semiconductor-...

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Main Authors: Tang, Seng-Haung, 湯森煌
Other Authors: Sheng-Fu Horng
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/49922596207431954004
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spelling ndltd-TW-085NTHU04420972015-10-13T18:05:33Z http://ndltd.ncl.edu.tw/handle/49922596207431954004 Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors 超快金屬半導體金屬光偵測器之電子束微影技術製作及模擬分析 Tang, Seng-Haung 湯森煌 碩士 國立清華大學 電機工程學系 85 Abstract There are two major parts in this thesis. One is to calibrate the newly setup SEM lithography system and to apply it to the fabrication of submicron Metal-Semiconductor- Metal (MSM) photodetectors. The other is to setup a comprehensive model to analyze the photocurrent response of GaAs MSM schottky photodiodes. In the first part, the frame size was first calibrated, and the backlash of the motor stage, the dwell time, the step size, as well as the probe current were then optimized. Other factors such as the thickness of PMMA, the baking condition, the exposure procedure, the metal thickness, the proximity effects, and then the focusing were also investigated. With all these optimization procedure, we succeeded in fabricating MSM photodetector with submicron metal line width and various spacing. In the second part of this thesis , the photoresponse of the MSM photodetectors was analyzed with 2-D simulator. Our simulation of the carrier transport in these structures reveals the strong influence of distance between the finger electrodes, the external voltage, the GaAs layer thickness, the temperature and the excitation intensity on the intrinsic response time and the corresponding frequency bandwidth of these photo detectors.We also calculated the performance for intrinsic devices with 0.5um interdigital spacing with the corresponding equivalent circuit of the photodetector. It is pointed out that parasitic effects may induce a significant distortion and a delay of intrinsic response. These can be minimized by choosing the optimal photodetector capacitance. Our results are consistent with that reported in the literature.Finally, nonuniform illumination to generate electric pulses from the transmission lines was also studied and a 3THz bandwidth was found for the transmission lines with 20um linewidth and spacing. Sheng-Fu Horng 洪勝富 1997 學位論文 ; thesis 150 zh-TW
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language zh-TW
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sources NDLTD
description 碩士 === 國立清華大學 === 電機工程學系 === 85 === Abstract There are two major parts in this thesis. One is to calibrate the newly setup SEM lithography system and to apply it to the fabrication of submicron Metal-Semiconductor- Metal (MSM) photodetectors. The other is to setup a comprehensive model to analyze the photocurrent response of GaAs MSM schottky photodiodes. In the first part, the frame size was first calibrated, and the backlash of the motor stage, the dwell time, the step size, as well as the probe current were then optimized. Other factors such as the thickness of PMMA, the baking condition, the exposure procedure, the metal thickness, the proximity effects, and then the focusing were also investigated. With all these optimization procedure, we succeeded in fabricating MSM photodetector with submicron metal line width and various spacing. In the second part of this thesis , the photoresponse of the MSM photodetectors was analyzed with 2-D simulator. Our simulation of the carrier transport in these structures reveals the strong influence of distance between the finger electrodes, the external voltage, the GaAs layer thickness, the temperature and the excitation intensity on the intrinsic response time and the corresponding frequency bandwidth of these photo detectors.We also calculated the performance for intrinsic devices with 0.5um interdigital spacing with the corresponding equivalent circuit of the photodetector. It is pointed out that parasitic effects may induce a significant distortion and a delay of intrinsic response. These can be minimized by choosing the optimal photodetector capacitance. Our results are consistent with that reported in the literature.Finally, nonuniform illumination to generate electric pulses from the transmission lines was also studied and a 3THz bandwidth was found for the transmission lines with 20um linewidth and spacing.
author2 Sheng-Fu Horng
author_facet Sheng-Fu Horng
Tang, Seng-Haung
湯森煌
author Tang, Seng-Haung
湯森煌
spellingShingle Tang, Seng-Haung
湯森煌
Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
author_sort Tang, Seng-Haung
title Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
title_short Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
title_full Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
title_fullStr Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
title_full_unstemmed Fabrication by Electron-Beam Lithography and Analysis of Ultrafast Metal-Semiconductor-Metal Photodetectors
title_sort fabrication by electron-beam lithography and analysis of ultrafast metal-semiconductor-metal photodetectors
publishDate 1997
url http://ndltd.ncl.edu.tw/handle/49922596207431954004
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