An investigation of stress and warpage in thermoset polymer packaging of microelectronic devices
碩士 === 國立雲林科技大學 === 機械工程技術研究所 === 86 === Recently,I.C package made progress with semiconductor estate development . Product property willtrend light, thin, short and small; it will cause product more accurate than past. The main factor of accuracy and constitute quality was controlling...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/30307745655090389881 |