A Study of Improving the Back-End Process Performance by Using Air-Gap and Cu Replacement
碩士 === 逢甲大學 === 電機工程學系 === 88 === There are two topics in this thesis. First topic is providing a method to manufacture copper metal line：Depositing a Poly-Si film on wafer and patterned by metal line mask, then put the wafer in the solution mixed by CuSO4、BOE and de-ionized water. The Si...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92602219997929169031 |