Recovery the Nanometric Particles of Silicon Oxide（SiO2）by Column Pressurized Flotation Technology.
碩士 === 國立成功大學 === 資源工程學系 === 88 === Abstract Chemo-mechanical polishing (CMP) is an important technique in the processing of Si wafer and interlevel dielectric planarization (ILD) in semiconductor manufactory. The CMP slurry made by several kinds of ultra-fine particles is generally expen...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58907832684395863745 |