Tungsten Probe Measuring System of Unpackaged Integration Circuit Chip and Related Process Technology
碩士 === 國立交通大學 === 電子工程系 === 88 === As the electronic application products are tending to the more and more small, modern wafer level packaging has to be developed. This technology cost much more than those of the traditional packaging methods. For saving the packaging cost, waf...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90636231151027650355 |