Investigation of Metal (Ti, TiN) Chemical Vapor Deposition and Copper Electrodeposition for ULSI Metallization Applications
博士 === 國立清華大學 === 材料科學工程學系 === 88 === Metal (Ti, TiN) chemical vapor deposition (CVD) and copper electrodeposition for future ULSI metallization applications have been investigated. For CVD barrier deposition, the conformal TiN films were deposited by thermal low-pressure chemical vapor deposition...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07310167978700391886 |