A Study of Crosslinked Polyamide-imide Synthesis and Application of Copper Foil/PAI Laminates
碩士 === 國立臺灣科技大學 === 纖維及高分子工程研究所 === 88 === The synthesis and thermal properties of addition polyamide-imides (PAI)adhesives which synthesized by Nadic anhydride(NA)、4-aminobenzoic acid、4,4’-ODA and NA、4-aminobenzoic acid、contain amide of diamine. The structures of PAI were characterized b...
Main Authors: | Yu Ting Chang, 張毓婷 |
---|---|
Other Authors: | Shou Chou |
Format: | Others |
Language: | zh-TW |
Published: |
2000
|
Online Access: | http://ndltd.ncl.edu.tw/handle/09906818668427800488 |
Similar Items
-
A Study of Polyamide-imide Copolymers Synthesis and Adhesion of Foil/PAI Laminate
by: Shu-Huei Huang, et al.
Published: (2001) -
Studies on Polyamide-imide Resin Synthesis and Copper Clad Laminate Properties
by: Chang Min Hui, et al.
Published: (2004) -
The crosslinking of polyamide-imide
by: TAO, HONG-YUAN, et al.
Published: (1986) -
The Study of Polyamide-imide Resin and Glass Fiber Treatment on Adhesion of Copper Clad Laminate
by: Fu-Yuan Chang, et al.
Published: (2002) -
Studies on the synthesis and properties of polyamide-imide and polyether-imide
by: TANG, REN-ZHONG, et al.
Published: (1989)