Materials and Fill Studies of Electroplated Copper by Pulse Current
碩士 === 國立交通大學 === 材料科學與工程系 === 89 === As device scales are narrowed down to submicron dimensions, the singal propagation is dominated by interconnection performance. But not by transistor switching speed. The performance of interconnection is dependent on its resistance and capacitance. I...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2001
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/89607411981507733386 |