Effect of Ni and Sn coating on the electrolytic migration of Cu-conductors, and the study of gold-embrittlement induced by reflow of the Sn-3.5Ag BGA solder on the gold-deposited Ni/Cu pads

碩士 === 國立中央大學 === 機械工程研究所 === 89 === Effect of Ni and Sn coating on the migration of Cu-conductors, and gold-embrittlement induced by reflow of the Sn-3.5Ag BGA solder on the gold deposited Ni/Cu pads have been studied. The migration of the Cu-conductors in distilled water, 0.01M Nacl and (NH4)2SO4...

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Bibliographic Details
Main Authors: Da-Hua Wei, 魏大華
Other Authors: Jing-Chie Lin
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/62428895181437742716