Effect of Ni and Sn coating on the electrolytic migration of Cu-conductors, and the study of gold-embrittlement induced by reflow of the Sn-3.5Ag BGA solder on the gold-deposited Ni/Cu pads
碩士 === 國立中央大學 === 機械工程研究所 === 89 === Effect of Ni and Sn coating on the migration of Cu-conductors, and gold-embrittlement induced by reflow of the Sn-3.5Ag BGA solder on the gold deposited Ni/Cu pads have been studied. The migration of the Cu-conductors in distilled water, 0.01M Nacl and (NH4)2SO4...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2001
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Online Access: | http://ndltd.ncl.edu.tw/handle/62428895181437742716 |