Electroplating of Copper deposits and Cobalt-Copper/Copper Multilayers
碩士 === 國立中正大學 === 化學工程研究所 === 90 === Copper deposits were electroplated by various plating modes including the galvanostatic plating, pulse-rest plating, pulse-reverse plating, cyclic voltammetry and potentiostatic plating methods in a simple CuSO4 electrolyte without any additives. The m...
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| Format: | Others |
| Language: | zh-TW |
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2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80303758480447687158 |