The Recrystallization Behavior of the Copper Deposit Electroplated in Sulfuric Acid Bath
碩士 === 長庚大學 === 機械工程研究所 === 90 === The microstructure and annealing behavior of the copper deposit, which was electroplated with sulfuric acid bath containing different concentrations of thiourea and chloride ion was reported in this study. Copper deposit was produced with a current densi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55835059439218754927 |