Investigation of Niobium Carbide as a Diffusion Barrier for Cu Metallization
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 90 === In this thesis, electrical and physical analyses were used to investigate the performance of niobium carbide (NbC) as a diffusion barrier in Cu metallization. In our study, physical analysis including XRD, XPS, SEM, AES, and SIMS depth profile were employed....
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8yafu9 |