化學機械研磨中鑽石修整器磨耗之研究
碩士 === 國立臺灣大學 === 機械工程學研究所 === 90 === Abstract The pad surface will become grazed because of the accumulated debris in the chemical mechanical polishing (CMP) process. This results in the reduction of the wafer removal rate, and a diamond disk must be frequently employed to refresh the pa...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33536792002598430219 |