A Study of the Chemical Mechanical Polishing and Elastic Emission Machining with the Assembly Super Precision Polishing Tool
碩士 === 華梵大學 === 機電工程研究所 === 91 === The purpose of this paper is to investigate the influence of the slurry consistency, polishing pad speed, workpiece speed, polishing pressure, feed rate, and flow rate of the chemical mechanical polishing (CMP) and elastic emission machining (EEM) of sil...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71175221283742894018 |