| Summary: | 碩士 === 國立成功大學 === 化學工程學系碩博士班 === 91 === Four kinds of diamines : 2,2-Bis[4-(4-aminophenoxy) phenyl]
propane (BAPP) and 1,3-Bis(4-aminophenoxy)benzene (APB) and two poly(siloxane)diamines of different equivalent amine weight in various mole ratio were reacted with trimellitic anhydride (TMA) to form the diimide-dicarboxylic acid intermediates. The diimide-dicarboxylic acid intermediates were farther reacted with 4,4-diphenylmethane diisocyanate (MDI) by the direct polycondensation to yield a series of polyamide-imides.
The inherent viscosity of polyamide-imides were ranged from 0.42~0.72dl/g. The glass transition temperatures (Tg) were ranged from 181~288oC and the weight-loss temperatures (Td) in nitrogen gas were ranged from 440~533oC and the solder resistane temperatures were above 250oC.In general, the thermal properties of the polyamide-imides decreased with the increase in diaminopoly(siloxane)s content, while the solubilities increased.
For all polyamide-imides synthesized,the stress at break were in the range of 18.3∼88.7MPa and the initial modulus were in the range of 0.2∼2Gpa and the strain at break were in the range of 2.7∼63％.The mechanical properties of the polyamide-imides became softer and tougher with the increase in diaminopoly(siloxane)s content.
Bisphenol A epoxy resin was cured with the polyamide-imides synthesized.The crosslinked structure of the cured products raised the Tgs of the polyamide-imide by 10~40 degree.
|
|---|
