Design,manufacture,simulation and test of burn-in socket for 3D MCM BGA packaging

碩士 === 國立清華大學 === 動力機械工程學系 === 91 ===

Bibliographic Details
Main Author: 蕭金首
Other Authors: 蕭德瑛
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/05853249191128243361