化學機械研磨中單顆鑽石於研磨墊上作用之探討
碩士 === 國立臺灣大學 === 機械工程學研究所 === 91 === Abstract The pad surface will become grazed because of the accumulated debris in the chemical mechanical polishing (CMP) process. This results in a reduction of the wafer removal rate, and a diamond conditioner (dresser) must be frequen...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/79075783944637461268 |